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However, the properties of EPDM Chip including elasticity and durability are decreased when exposed to ultraviolet ray and scenic paving functions through various colors are lowered due to the yellowing phenomenon. Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. T. Bjorninen, M. Lauri, L. Ukkonen, R. Ritala, A. Z. Elsherbeni, and L. Sydanheimo, "Wireless measuremnet of RFID IC impedance", IEEE Trans. Jeenmo Yang, Junho Yeo, "Chip impedance evaluation method for UHF RFID transfonder ICs over absorbed input power", ETRI Journal, vol. Suhwan Chae and Kyungkoo Jun, "Automatic Coin Calculation System using Circular Hough Transform and Post-processing Techniques," Journal of Korea Multimedia Society, Vol. Latest Advancements and Trends. CV4: the concentration value based on the maximum to fourth largest RECC values, (rmax, cmax), (ri, ci): the image coordinates of the positions of the maximum RECC and i-th largest RECC values, respectively. |
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